High-bandwidth memory (HBM) is DRAM stacked in layers and connected through thousands of vertical channels (through-silicon vias), then placed right next to an AI accelerator such as an Nvidia GPU. Every new generation of AI chips needs more of it, and two of the three companies that can make it at scale are Korean: SK hynix and Samsung Electronics.
SK hynix has been widely reported as the main HBM supplier for Nvidia's recent accelerators, and Samsung Electronics has been working through qualification for newer generations. Around them sits a group of smaller KOSPI and KOSDAQ listed suppliers: Hanmi Semiconductor makes the thermo-compression bonders that stack the dies, Hana Micron does packaging and testing, Techwing builds test handlers, ISC makes test sockets, EO Technics supplies laser equipment and HPSP sells high-pressure annealing tools used in advanced logic and memory.
For an investor outside Korea the useful signals are Korean-language: supply contract filings on DART (단일판매·공급계약), capacity investment filings, quarterly results and the news flow after each Nvidia earnings call. This page gathers them for the companies above and translates headlines and filing titles into English.
How to read this page
Start with the filings column: a supply contract filing shows the contract amount as a share of recent revenue, which tells you how material an order is for a small equipment maker. Then compare the news count over 30 days — a sudden jump often follows an Nvidia product event, a customer qualification report or quarterly results.
Information only — not investment advice. Headlines and filing titles are machine-translated from Korean; each links to the original Korean source. Updated: